WaferX 300 process XRF tool for thin film evaluation
Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology—servicing 6", 8", as well as the latest 12" wafers.
Features
- Simultaneous thickness and composition measurement
- BPSG, PSG, and metal films
- Thin film BPSG, multilayered circuit film, WSix, electrode films
- Ferrodielectric thin films, FRAM, next generation DRAM, SiOF
- Analysis to support sub-micron technology
- Highly accurate analyses for the ultralight elements such as B and P in BPSG film has been improved significantly by employing a 4kW high power X-ray tube incorporation a super thin window.
- Advanced design
- Employs a wafer height adjustment mechanism to compensate for differences in wafer thickness, and a diffraction beam removal mechanism to eliminate diffraction interference for the transition metals.
- Integrated FOUP(SMIF)
- C-to-C standard
- Various user cassettes can be loaded
- FOUP(SMIF) through-the-wall option is available