TXRF-310 total reflection XRF spectrometer

Quick contamination inspection for semiconductor processes

• Accepts 300 mm (12"), 200 mm (8") and 150 mm (6")
• Effective inspection of process contamination at various stages: cleaning, film deposition, exposure, etching, etc.

Wide range of analytical elements (Na~U), high performance ultra trace analysis

• Single target 3-beam method and XYZθφ stage are unique to Rigaku, enabling highly accurate ultra trace analysis over the entire wafer surface

Notch search/centering of wafer on the sample stage

• Easy and accurate analysis position identification
• Import of measurement coordinates from other defect inspection tools for follow-up analysis

High-volume production ready

• FOUP, SMIF, and through-the-wall option are available to meet the various needs of wafer fabs
• GEM-300 automation software for full factory automation

SP-TXRF capability enables mapping of the entire wafer surface 

ZEE-TXRF capability enables measurements to zero edge exclusion 

BAC-TXRF capability enables fully-automated front-side and back-side measurements