Semiconductor metrology for wafer contamination
As described in the various ITRS Roadmaps released over the past decades, contamination control is one of the central issues facing semiconductor fabrication lines. Thus, characterization and subsequent control of in-process contaminants is a major predictor of yields. These tools have become critical for quickly and easily measuring contamination levels on front or wafer backsides at various key-processing steps. Rigaku offers 200 mm and 300 mm Total Reflection X-ray Fluorescence (TXRF) and integrated Vapor Phase Decomposition TXRF (or VPD-TXRF) tools providing state-of-the-art contamination metrology. The systems are available in several configurations to meet every wafer size, element, environment and automation requirement.
A pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges, Rigaku has provided over 30 years of global semi metrology leadership.